Atomic Layer Deposition (ALD) is a thin-film deposition technique that allows for the precise control of film thickness at the atomic level. It operates on the principle of alternating exposure of the substrate to two or more gaseous precursors, which react to form a monolayer of material on the surface. This process is characterized by its self-limiting nature, meaning that each cycle deposits a fixed amount of material, typically one atomic layer, making it highly reproducible and uniform.
The general steps in an ALD cycle can be summarized as follows:
This technique is widely used in various industries, including electronics and optics, for applications such as the fabrication of semiconductor devices and coatings. Its ability to produce high-quality films with excellent conformality and uniformity makes ALD a crucial technology in modern materials science.
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